Opportunity

NextFlex: Project Call 10.0

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Electronics, Flexible Hybrid Electronics, Funding Opportunity

NextFlex Project Calls fulfill one of the Institute’s primary goals: fostering technology innovation and commercialization.

Project Call (PC) 10.0 is the tenth project call issued by NextFlex. Like the previous project calls, it is intended to advance the state of the art in manufacturing for hybrid electronics and to promote the strength, competitiveness, and interconnectedness of the U.S. manufacturing ecosystem for hybrid electronics. Each NextFlex project call builds from and implements changes relative to past project calls, and all proposers should carefully read all sections of this guidebook to understand changes in proposal development, required content, submission, evaluation, eligibility, and selection criteria. Important considerations for PC 10.0:

  • Proposal process will be 1-stage (straight to full proposal) – there is no pre-proposal round
  • Discussion with NextFlex during proposal development is strongly encouraged to ensure that proposals align to the goals of the topics
  • Projects are expected to be technically focused and of modest duration (maximum duration from 12 to 18 months, by topic)
  • Topic areas are broadly defined, allowing proposers to determine the specific subject of their proposal; proposals should explain the importance and relevance of the chosen subject
  • Alignment of proposals to DoD Critical Technology Areas and other DoD priorities are strongly encouraged (for more information, see https://www.cto.mil/usdre-strat-vision-critical-tech-areas/)
  • Projects that leverage prior NextFlex investments are encouraged. All projects should have meaningful impact on U.S. hybrid electronics manufacturing and technology.

Topics for PC 10.0 include:

  • Topic 10.1: Maturing and Derisking Hybrid Electronics Manufacturing Processes and Devices
  • Topic 10.2: AI/ML for Design, Manufacturing, and Qualification of Hybrid Electronics
  • Topic 10.3: Hybrid Electronics Platform Demonstrator
  • Topic 10.4: Additive Manufacturing and Repair of Electronics in the Defense Industrial Base
  • Topic 10.5: Platform Demonstrator for Reduced Life Cycle Costs and Improved DoD Readiness
  • Topic 10.6: Open Topic for “New Project Leads”

Online Cover Sheet Submission Deadline: May 14, 2025 

Proposal Submission Deadline: May 21, 2025 by 5PM PST